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ALPHA CVP-520 Low Temp Lead Free No-Clean Solder Paste, Sn42Bi57.6Ag0.4, 84.5-3-M07, 125g Syringe

Hisco #:154317-1998

MFG #:CVP-520

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
$
Manufacturer Lead Time When Not In Stock23 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24

The ALPHA CVP-520 is a Series CVP-520 zero halogen solder paste .

The ALPHA CVP-520 Features:
  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
  • Reduces energy consumption in reflow ovens versus standard lead free alloys
  • Reduces reflow process cycle time
  • Delivers 8 Hour stencil life
  • Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
  • Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Excellent resistance to random solder balling minimizing rework and increasing first time yield
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
  • Meets highest IPC 7095 voiding performance (Class III)
  • Provides excellent electrical reliability properties
  • Zero halogen (no halogen intentionally added) and halide-free material
  • Compatible with either nitrogen or air reflow
The ALPHA CVP-520 Specifications:
  • Series: CVP-520
  • Product Type: Zero Halogen Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn42Bi57.6Ag0.4
  • Applications: Soldering, Desoldering
  • Standards Met: IPC 7095 voiding performance Class III, IPC J-STD-005, RoHS Compliant, J-STD-004, JIS Z 3197 -1999 8.4.1, JIS Z 3197 1999, JIS Z-3284-1994 Annex 8
  • Container Type: Syringe
  • Capacity: 30cc

Product Description

The ALPHA CVP-520 is a Series CVP-520 zero halogen solder paste .

The ALPHA CVP-520 Features:
  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
  • Reduces energy consumption in reflow ovens versus standard lead free alloys
  • Reduces reflow process cycle time
  • Delivers 8 Hour stencil life
  • Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
  • Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Excellent resistance to random solder balling minimizing rework and increasing first time yield
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
  • Meets highest IPC 7095 voiding performance (Class III)
  • Provides excellent electrical reliability properties
  • Zero halogen (no halogen intentionally added) and halide-free material
  • Compatible with either nitrogen or air reflow
The ALPHA CVP-520 Specifications:
  • Series: CVP-520
  • Product Type: Zero Halogen Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn42Bi57.6Ag0.4
  • Applications: Soldering, Desoldering
  • Standards Met: IPC 7095 voiding performance Class III, IPC J-STD-005, RoHS Compliant, J-STD-004, JIS Z 3197 -1999 8.4.1, JIS Z 3197 1999, JIS Z-3284-1994 Annex 8
  • Container Type: Syringe
  • Capacity: 30cc

Technical Information

BrandAlpha
Weight: 0.25
Country Of Origin: MX
Tariff Code: 7106.92.01.00
UPC Code: No UPC

Additional Resources

$
 
Minimum Order QTY: 24
Item must be ordered in multiples of 24
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