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ALPHA JP-501 Lead Free Solder Paste, Sn42Bi57.6Ag0.4, 85-5-M08, 100g Syringe

Hisco #:160063-1998

MFG #:JP-501

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Our Price: $52.61 Syringe-SZ
Manufacturer Lead Time When Not In Stock27 days
Minimum Order QTY: 48
Item must be ordered in multiples of 48
QuantityPriceSave
14451.30Save 2%

The ALPHA JP-501 is a Series CVP-500 no-clean solder paste .

The ALPHA JP-501 Features:
  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
  • Reduces energy consumption in reflow ovens versus standard lead free alloys
  • Reduces reflow process cycle time
  • Delivers 8 Hour stencil life
  • Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
  • Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Excellent resistance to random solder balling minimizing rework and increasing first time yield
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
  • Meets highest IPC 7095 voiding performance (Class III)
  • Provides excellent electrical reliability properties
  • Zero halogen (no halogen intentionally added) and halide-free material
  • Compatible with either nitrogen or air reflow
The ALPHA JP-501 Specifications:
  • Series: CVP-500
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn42Bi57.6Ag0.4
  • Applications: Soldering
  • Standards Met: Meets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
  • Container Type: Syringe
  • Capacity: 30cc

Product Description

The ALPHA JP-501 is a Series CVP-500 no-clean solder paste .

The ALPHA JP-501 Features:
  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
  • Reduces energy consumption in reflow ovens versus standard lead free alloys
  • Reduces reflow process cycle time
  • Delivers 8 Hour stencil life
  • Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
  • Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Excellent resistance to random solder balling minimizing rework and increasing first time yield
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
  • Meets highest IPC 7095 voiding performance (Class III)
  • Provides excellent electrical reliability properties
  • Zero halogen (no halogen intentionally added) and halide-free material
  • Compatible with either nitrogen or air reflow
The ALPHA JP-501 Specifications:
  • Series: CVP-500
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn42Bi57.6Ag0.4
  • Applications: Soldering
  • Standards Met: Meets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
  • Container Type: Syringe
  • Capacity: 30cc

Technical Information

BrandAlpha
SeriesJP-501
Chemical CompositionSn42Bi57.6Ag0.4
Product TypeNo-Clean Solder Paste
Physical FormPaste
ApplicationsSoldering
Standards MetMeets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
Container TypeSyringe
Capacity30cc
Weight: 0.002
Country Of Origin: MX
Our Price: $52.61 Syringe-SZ
 
Minimum Order QTY: 48
Item must be ordered in multiples of 48
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