ALPHA JP-501 Lead Free Solder Paste, Sn42Bi57.6Ag0.4, 85-5-M08, 100g Syringe
Hisco #:160063-1998
MFG #:JP-501
Our Price: $55.49 Syringe-SZ
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 27 days
Minimum Order QTY: 48
Item must be ordered in multiples of 48
Item must be ordered in multiples of 48
| Quantity | Price | Save |
|---|---|---|
| 144 | 54.10 | Save |
The ALPHA JP-501 is a Series CVP-500 no-clean solder paste .
The ALPHA JP-501 Features:- Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
- Reduces energy consumption in reflow ovens versus standard lead free alloys
- Reduces reflow process cycle time
- Delivers 8 Hour stencil life
- Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
- Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
- Excellent resistance to random solder balling minimizing rework and increasing first time yield
- Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
- Meets highest IPC 7095 voiding performance (Class III)
- Provides excellent electrical reliability properties
- Zero halogen (no halogen intentionally added) and halide-free material
- Compatible with either nitrogen or air reflow
- Series: CVP-500
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn42Bi57.6Ag0.4
- Applications: Soldering
- Standards Met: Meets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
- Container Type: Syringe
- Capacity: 30cc
Product Description
Technical Information
SDS/TDS
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Product Description
The ALPHA JP-501 is a Series CVP-500 no-clean solder paste .
The ALPHA JP-501 Features:- Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used
- Reduces energy consumption in reflow ovens versus standard lead free alloys
- Reduces reflow process cycle time
- Delivers 8 Hour stencil life
- Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering
- Compatible with all commonly used lead free surface finishes (Entek HT, Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
- Excellent resistance to random solder balling minimizing rework and increasing first time yield
- Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate
- Meets highest IPC 7095 voiding performance (Class III)
- Provides excellent electrical reliability properties
- Zero halogen (no halogen intentionally added) and halide-free material
- Compatible with either nitrogen or air reflow
- Series: CVP-500
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn42Bi57.6Ag0.4
- Applications: Soldering
- Standards Met: Meets highest IPC 7095 III, RoHS Compliant, ROL0 Classification IPC J-STD-004, JIS Z 3197 1999, Bellcore GR78-CORE
- Container Type: Syringe
- Capacity: 30cc
Technical Information
Brand: Alpha
Weight: 0.2
Country Of Origin: MX
Harmonized Code: 3810.10.0000
UPC Code: No UPC
Our Price: $55.49 Syringe-SZ
Available to Order - 0 on Hand
Minimum Order QTY: 48
Item must be ordered in multiples of 48
Item must be ordered in multiples of 48