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OM-5300 No-Clean Tin -Lead Solder Paste, Sn63Pb37, 90-4-M18, 500g Jar

162714-1998 MFG #: 162714
$92.11 / JR
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24 $88.97
72 $86.03 Save 3 %
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  • Brand Name: Alpha
  • Series: OM-5300
  • Chemical Composition: Sn63Pb37
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Applications: Soldering
  • Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g
  • Color: Clear
  • Container Size: 500 g
  • Storage Conditions: 45

The Alpha 162714 is a Series OM5300 no-clean solder paste .

The Alpha 162714 Features:
  • Print Consistency:Lower "deposit to deposit" variation drives maximization of first pass print and reflow yields
  • Fine Feature Capability:High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes
  • Low BGA Voiding:Class III voiding resistance even when SAC 305 BGA spheres are used
  • Electrical Reliability:Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests
  • Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly
  • Excellent response to pause performance, generating fewer defects due to start up
  • High print speed, up to 150 mm/sec (6 inch/sec)
  • Efficient activation system providing defect free soldering with a wide range of oven profiles
  • High yield for in circuit testing (low level of false negatives)
The Alpha 162714 Specifications:
  • Series: OM5300
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Applications: Soldering
  • Standards Met: IPC and Bellcore SIR, IPC J-STD-005, J-STD-004, DIN Standard 32 513
  • Container Type: Jar
  • Capacity: 500g
Pack: Jar
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