US_HISCO_SPIRE

Thermal Cure Silicone System, 850G AG/CU, CHOFORM 2 Part Kit

Hisco #:19-26-5513-0850-5200

MFG #:19-26-5513-0850

Our Price: $2,141.72 Kit
Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock48 days
Minimum Order QTY: 1 Kit
Item must be ordered in multiples of 1
QuantityPriceSave
12141.72
31931.79Save

The Parker 19-26-5513-0850 is a form-in-place gasket material ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. CHO-FORM can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level.

Parker 19-26-5513-0850 Features:
  • Up to 60% reduced installation cost and nominal cost for production scale-up
  • Up to 60% space savings within enclosures
  • Excellent adhesion to common housing substrates
  • Highly compressible gaskets, ideal for low closure force housings
  • Quick turn-around of prototypes and samples
Parker 19-26-5513-0850 Specifications:
  • Brand: Parker
  • Series: CHO-FORM
  • Storage Temperature: -10°C
  • Package Type: 12 Fluid Ounce SEMCO Tube
  • Filler Material: Ag/Cu
  • Polymer Material Options: Silicone
  • Durometer: 53 Shore A
  • Tensile Strength: 2.4
  • Specific Gravity: 3.4
  • Weight (g): Part A 450, Part B 475
  • Shelf Life: 6 months

Product Description

The Parker 19-26-5513-0850 is a form-in-place gasket material ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. CHO-FORM can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level.

Parker 19-26-5513-0850 Features:
  • Up to 60% reduced installation cost and nominal cost for production scale-up
  • Up to 60% space savings within enclosures
  • Excellent adhesion to common housing substrates
  • Highly compressible gaskets, ideal for low closure force housings
  • Quick turn-around of prototypes and samples
Parker 19-26-5513-0850 Specifications:
  • Brand: Parker
  • Series: CHO-FORM
  • Storage Temperature: -10°C
  • Package Type: 12 Fluid Ounce SEMCO Tube
  • Filler Material: Ag/Cu
  • Polymer Material Options: Silicone
  • Durometer: 53 Shore A
  • Tensile Strength: 2.4
  • Specific Gravity: 3.4
  • Weight (g): Part A 450, Part B 475
  • Shelf Life: 6 months

Technical Information

BrandParker
Weight: 2.1

Additional Resources

Our Price: $2,141.72 Kit
Available to Order - 0 on Hand
 
Minimum Order QTY: 1 Kit
Item must be ordered in multiples of 1