ALPHA OM-550 HRL1 Type 5 Powder Low Temperature Lead Free Solder Paste, 500g Jar
Hisco #:246836-1998
MFG #:OM-550 HRL1
Item must be ordered in multiples of 24
| Quantity | Price | Save |
|---|---|---|
| 72 | 178.00 | Save |
The ALPHA OM-550 HRL1 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.
ALPHA OM-550 HRL1 Features:- Low reflow peak temperature ~175°C (~185°C – 195°C for mixed alloy process
- Reduction of warpage up to 99% (component and board/substrate) vs SAC process
- Excellent NWO Performance
- Excellent HIP Performance
- Improves BGA mechanical reliability compared to other low-temp alloys
- Fine Feature Printing/Reflow Capable
- Long Stencil Life - 12 Hours with continuous printing
- Less residue spread
- Good voiding performance on various packages (BGA, MLF, DPAK, LGA)
- Reflowable in air or nitrogen
- Provides efficiencies in both energy and cost
- Alloys: HRL1 alloy
- Powder size: Type 5
- Packaging sizes: 500 gram jar
- Lead-free
- Zero-Halogen
Product Description
The ALPHA OM-550 HRL1 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.
ALPHA OM-550 HRL1 Features:- Low reflow peak temperature ~175°C (~185°C – 195°C for mixed alloy process
- Reduction of warpage up to 99% (component and board/substrate) vs SAC process
- Excellent NWO Performance
- Excellent HIP Performance
- Improves BGA mechanical reliability compared to other low-temp alloys
- Fine Feature Printing/Reflow Capable
- Long Stencil Life - 12 Hours with continuous printing
- Less residue spread
- Good voiding performance on various packages (BGA, MLF, DPAK, LGA)
- Reflowable in air or nitrogen
- Provides efficiencies in both energy and cost
- Alloys: HRL1 alloy
- Powder size: Type 5
- Packaging sizes: 500 gram jar
- Lead-free
- Zero-Halogen
Technical Information
Additional Resources
Item must be ordered in multiples of 24