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ALPHA OM-550 HRL1 Type 5 Powder Low Temperature Lead Free Solder Paste, 500g Jar

Hisco #:246836-1998

MFG #:OM-550 HRL1

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
This item is a hazardous material and MAY be subjected to extra shipping charges/fees. If the product requires extra charges, ground hazmat items will be charged a $30.00 fee per carton and air hazmat items will be charged a $60 fee per carton.
Our Price: $118.53 Jar-JR
Manufacturer Lead Time When Not In Stock10 days
Minimum Order QTY: 24
Item must be ordered in multiples of 24
QuantityPriceSave
72115.57Save 2%

HazardousThis item is hazardous and may be subject to an additional handling fee.

The ALPHA OM-550 HRL1 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.

ALPHA OM-550 HRL1 Features:
  • Low reflow peak temperature ~175°C (~185°C – 195°C for mixed alloy process
  • Reduction of warpage up to 99% (component and board/substrate) vs SAC process
  • Excellent NWO Performance
  • Excellent HIP Performance
  • Improves BGA mechanical reliability compared to other low-temp alloys
  • Fine Feature Printing/Reflow Capable
  • Long Stencil Life - 12 Hours with continuous printing
  • Less residue spread
  • Good voiding performance on various packages (BGA, MLF, DPAK, LGA)
  • Reflowable in air or nitrogen
  • Provides efficiencies in both energy and cost
ALPHA OM-550 HRL1 Specifications:
  • Alloys: HRL1 alloy
  • Powder size: Type 5
  • Packaging sizes: 500 gram jar
  • Lead-free
  • Zero-Halogen

Product Description

HazardousThis item is hazardous and may be subject to an additional handling fee.

The ALPHA OM-550 HRL1 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.

ALPHA OM-550 HRL1 Features:
  • Low reflow peak temperature ~175°C (~185°C – 195°C for mixed alloy process
  • Reduction of warpage up to 99% (component and board/substrate) vs SAC process
  • Excellent NWO Performance
  • Excellent HIP Performance
  • Improves BGA mechanical reliability compared to other low-temp alloys
  • Fine Feature Printing/Reflow Capable
  • Long Stencil Life - 12 Hours with continuous printing
  • Less residue spread
  • Good voiding performance on various packages (BGA, MLF, DPAK, LGA)
  • Reflowable in air or nitrogen
  • Provides efficiencies in both energy and cost
ALPHA OM-550 HRL1 Specifications:
  • Alloys: HRL1 alloy
  • Powder size: Type 5
  • Packaging sizes: 500 gram jar
  • Lead-free
  • Zero-Halogen

Technical Information

BrandAlpha
Product TypeSolder Paste
Country Of Origin: MX

Additional Resources

Our Price: $118.53 Jar-JR
 
Minimum Order QTY: 24
Item must be ordered in multiples of 24
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