ALPHA OM-550 HRL1 Alloy Solder Paste, 88-4-M19, 600g Cartridge
Hisco #:247241-1998
MFG #:247241
Item must be ordered in multiples of 12
| Quantity | Price | Save |
|---|---|---|
| 20 | 166.37 | Save |
| 60 | 161.63 | Save |
The ALPHA 247241 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.
ALPHA 247241 Features:- Low reflow peak temperature ~175°C (~185°C – 195°C for mixed alloy process
- Reduction of warpage up to 99% (component and board/substrate) vs SAC process
- Excellent NWO Performance
- Excellent HIP Performance
- Improves BGA mechanical reliability compared to other low-temp alloys
- Fine Feature Printing/Reflow Capable
- Long Stencil Life - 12 Hours with continuous printing
- Less residue spread
- Good voiding performance on various packages (BGA, MLF, DPAK, LGA)
- Reflowable in air or nitrogen
- Provides efficiencies in both energy and cost
- Alloys: HRL1 alloy
- Powder size: Type 4
- Packaging sizes: 600g Cartridge
- Lead-free
- Zero-Halogen
Product Description
The ALPHA 247241 is a new low temperature chemistry paired with ALPHA’s HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.
ALPHA 247241 Features:- Low reflow peak temperature ~175°C (~185°C – 195°C for mixed alloy process
- Reduction of warpage up to 99% (component and board/substrate) vs SAC process
- Excellent NWO Performance
- Excellent HIP Performance
- Improves BGA mechanical reliability compared to other low-temp alloys
- Fine Feature Printing/Reflow Capable
- Long Stencil Life - 12 Hours with continuous printing
- Less residue spread
- Good voiding performance on various packages (BGA, MLF, DPAK, LGA)
- Reflowable in air or nitrogen
- Provides efficiencies in both energy and cost
- Alloys: HRL1 alloy
- Powder size: Type 4
- Packaging sizes: 600g Cartridge
- Lead-free
- Zero-Halogen
Technical Information
Additional Resources
Item must be ordered in multiples of 12