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ALPHA HiTech CU13-3150 Underfill, 10cc EFD Syringe, 11 gram

249742-0011GM-1998 MFG #: HiTech CU13-3150
$20.48 / SZ
Available to Order - 0 on Hand

The ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.

ALPHA HiTech CU13-3150 Features:
  • Low temperature thermal cure underfill
  • Low Viscosity due to no filler
  • Fast Cure at Low Temperatures
  • Excellent adhesion and Drop Shock performance
  • Anhydride Free
  • NON-REWORKABLE