HiTech CU13-3150 Underfill, 10cc EFD Syringe, 11 gram
249742-0011GM-1998
MFG #: 249742.0011GM
$20.48
/ SZ
Available to Order - 0 on Hand
The Alpha 249742.0011GM is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
Alpha 249742.0011GM Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE