ALPHA HiTech CF12-4485B Edgebond, 30cc Iwashita Syringe, 36 gram
Hisco #:251069-0036GMI-1998
MFG #:HiTech CF12-4485B
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 60.30 | |
| 10 | 58.53 | Save |
| 30 | 56.86 | Save |
The ALPHA HiTech CF12-4485B is a one-component, low temperature cure, Edgebond epoxy system designed to provide protection to the solder joint during mechanical stress. ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required. Provides excellent adhesion strength, excellent thermal cycling performance, and multiple curing options. Well suited for consumer electronics assemblies.
ALPHA HiTech CF12-4485B Features:- Due to the low Tg it is optimally suited for Consumer Electronics / White Goods / Wearables / Medical / Power tools
- Excellent Adhesion on FR4 board
- Lower Temperature Cure capability
- Anhydride Free
- NON-REWORKABLE
Product Description
The ALPHA HiTech CF12-4485B is a one-component, low temperature cure, Edgebond epoxy system designed to provide protection to the solder joint during mechanical stress. ALPHA HiTech CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required. Provides excellent adhesion strength, excellent thermal cycling performance, and multiple curing options. Well suited for consumer electronics assemblies.
ALPHA HiTech CF12-4485B Features:- Due to the low Tg it is optimally suited for Consumer Electronics / White Goods / Wearables / Medical / Power tools
- Excellent Adhesion on FR4 board
- Lower Temperature Cure capability
- Anhydride Free
- NON-REWORKABLE
Technical Information
Item must be ordered in multiples of 1