ALPHA HiTech CU11-3127 Underfill, 30cc EFD Syringe, 50 gram
Hisco #:259033-0050GME-1998
MFG #:HiTech CU11-3127
Item must be ordered in multiples of 6
| Quantity | Price | Save |
|---|---|---|
| 10 | 98.85 | Save |
| 30 | 96.03 | Save |
The ALPHA HiTech CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA HiTech CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending. ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. With a unique low viscosity property, no preheat is required for this product.
ALPHA HiTech CU11-3127 Features:- More effective at higher operating temperatures than CU21-3240
- Higher Tg is the key differentiator with Low CTE
- Contains Anhydrides
- NON-REWORKABLE
Product Description
The ALPHA HiTech CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA HiTech CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending. ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. With a unique low viscosity property, no preheat is required for this product.
ALPHA HiTech CU11-3127 Features:- More effective at higher operating temperatures than CU21-3240
- Higher Tg is the key differentiator with Low CTE
- Contains Anhydrides
- NON-REWORKABLE
Technical Information
Item must be ordered in multiples of 6