ALPHA OM-363 771 88.2-4-M11 Solder Paste, SAC305, 500g Jar
Hisco #:281352-0012-1998
MFG #:OM-363
Item must be ordered in multiples of 12
| Quantity | Price | Save |
|---|---|---|
| 36 | 146.69 | Save |
The ALPHA OM-363
ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is designed to provide ultra-low voiding performance on all component types, especially bottom terminated components.
ALPHA OM-362 achieves IPC Class III voiding on BGA components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
ALPHA OM-363 Features:- Ultra-Low voiding performance
- Excellent electromigration characteristics
- Good coalescence and wetting performance
- Excellent solder joint and flux residue cosmetics
- Zero-halogen, No halogens intentionally added
Product Description
The ALPHA OM-363
ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is designed to provide ultra-low voiding performance on all component types, especially bottom terminated components.
ALPHA OM-362 achieves IPC Class III voiding on BGA components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
ALPHA OM-363 Features:- Ultra-Low voiding performance
- Excellent electromigration characteristics
- Good coalescence and wetting performance
- Excellent solder joint and flux residue cosmetics
- Zero-halogen, No halogens intentionally added
Technical Information
Item must be ordered in multiples of 12