Cho Bond 584-29 Two Component Epoxy Cho-Pak, 1gram
Hisco #:50-10-0584-0029-5200
MFG #:50-10-0584-0029
$
Manufacturer Lead Time When Not In Stock: 7 days
Minimum Order QTY: 120
Item must be ordered in multiples of 120
Item must be ordered in multiples of 120
The Cho-Bond 50-10-0584-0029 is a Series 584 epoxy adhesive with a mix ratio of 100:6.3.
The Cho-Bond 50-10-0584-0029 Features:- Fast heat cure, increase throughput, minimizes equipment downtime
- Excellent conductivity 0.002 ohm-cm
- 30 minute working life, works well over wide temperature range, good chemical resistance >1200 psi lab shear, good for permanently bonding surfaces
- No weighing required, mix and dispense in same package, minimizes process scrap
- May be dispensed out of very small needles, fill small cracks and voids
- Minimal shrinkage
- Brand: CHO-BOND®
- Series: 584
- Product Type: Epoxy Adhesive
- Hardness: 80Shore D
- Color: Silver
- Primary Color: Silver
- Mix Ratio: 100:6.3
- Physical Form: Very Thin Paste
- Cure Time: 24h
- Shelf Life: 12month
- Chemical Composition: Polymer
- Specific Gravity: 2.5
- VOCs Content: 3g/L
- Cure Type: Room Temperature
- Maximum Operating Temperature: +257°F
- Minimum Operating Temperature: -67°F
- Container Capacity: 1g
- Container Type: Cho-Pak
- Applications: Bonding and Grounding of Electrical Components, Cold Soldering, Sealing Machined Enclosures
Product Description
Technical Information
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Product Description
The Cho-Bond 50-10-0584-0029 is a Series 584 epoxy adhesive with a mix ratio of 100:6.3.
The Cho-Bond 50-10-0584-0029 Features:- Fast heat cure, increase throughput, minimizes equipment downtime
- Excellent conductivity 0.002 ohm-cm
- 30 minute working life, works well over wide temperature range, good chemical resistance >1200 psi lab shear, good for permanently bonding surfaces
- No weighing required, mix and dispense in same package, minimizes process scrap
- May be dispensed out of very small needles, fill small cracks and voids
- Minimal shrinkage
- Brand: CHO-BOND®
- Series: 584
- Product Type: Epoxy Adhesive
- Hardness: 80Shore D
- Color: Silver
- Primary Color: Silver
- Mix Ratio: 100:6.3
- Physical Form: Very Thin Paste
- Cure Time: 24h
- Shelf Life: 12month
- Chemical Composition: Polymer
- Specific Gravity: 2.5
- VOCs Content: 3g/L
- Cure Type: Room Temperature
- Maximum Operating Temperature: +257°F
- Minimum Operating Temperature: -67°F
- Container Capacity: 1g
- Container Type: Cho-Pak
- Applications: Bonding and Grounding of Electrical Components, Cold Soldering, Sealing Machined Enclosures
Technical Information
Brand: Cho-Bond
Weight: 0.01
$
Minimum Order QTY: 120
Item must be ordered in multiples of 120
Item must be ordered in multiples of 120