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EP256 Series No-Clean Solder Paste, Type 3, Sn63Pb37, 500 Gram Jar

Hisco #:70-0102-0510-16600

MFG #:EP256

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Made in the USA
No Cancel, No Returns. Orders placed for this product are non-refundable and cannot be cancelled.
Our Price: $109.97 Jar-JR
Manufacturer Lead Time When Not In Stock15 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1109.97
3104.61Save 5%

The Kester EP256 is a Series EP256 no-clean solder paste .

Kester EP256 Features:
  • Stable wetting behavior over a wide range of profiles
  • Capable of 90 minute break times in printing
  • High print speeds to 200+ mm/sec (8+ in/sec)
  • Compatible with enclosed print head systems
  • Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
  • High activity on all substrates, including OSPs
  • Capable of off-pad printing with no solderballs after reflow
  • Stencil life:8+ hours (process dependent)
  • Scrap is reduced due to less paste dry out
  • Stable tack over 8+ hours
Kester EP256 Specifications:
  • Brand: Kester®
  • Series: EP256
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Product Description

The Kester EP256 is a Series EP256 no-clean solder paste .

Kester EP256 Features:
  • Stable wetting behavior over a wide range of profiles
  • Capable of 90 minute break times in printing
  • High print speeds to 200+ mm/sec (8+ in/sec)
  • Compatible with enclosed print head systems
  • Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
  • High activity on all substrates, including OSPs
  • Capable of off-pad printing with no solderballs after reflow
  • Stencil life:8+ hours (process dependent)
  • Scrap is reduced due to less paste dry out
  • Stable tack over 8+ hours
Kester EP256 Specifications:
  • Brand: Kester®
  • Series: EP256
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandKester
SeriesEP256
Chemical CompositionSn63Pb37
Product TypeNo-Clean Solder Paste
Physical FormPaste
OdorMild
ApplicationsSoldering
Standards MetClassified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
Container TypeJar
Capacity500g
AvailabilityIn Stock
Country Of Origin: US
Our Price: $109.97 Jar-JR
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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