EP256 Series No-Clean Solder Paste, Type 3, Sn63Pb37, 500 Gram Jar
Hisco #:70-0102-0510-16600
MFG #:EP256
Our Price: $149.14 Jar-JR
Manufacturer Lead Time When Not In Stock: 7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 172.78 | |
| 1 | 149.13 | Save 14% |
| 3 | 131.18 | Save 24% |
The Kester EP256 is a Series EP256 no-clean solder paste .
The Kester EP256 Features:- Stable wetting behavior over a wide range of profiles
- Capable of 90 minute break times in printing
- High print speeds to 200+ mm/sec (8+ in/sec)
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
- High activity on all substrates, including OSPs
- Capable of off-pad printing with no solderballs after reflow
- Stencil life:8+ hours (process dependent)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hours
- Brand: Kester®
- Series: EP256
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Mild
- Applications: Soldering
- Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
- Container Type: Jar
- Capacity: 500g
Product Description
Technical Information
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Product Description
The Kester EP256 is a Series EP256 no-clean solder paste .
The Kester EP256 Features:- Stable wetting behavior over a wide range of profiles
- Capable of 90 minute break times in printing
- High print speeds to 200+ mm/sec (8+ in/sec)
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
- High activity on all substrates, including OSPs
- Capable of off-pad printing with no solderballs after reflow
- Stencil life:8+ hours (process dependent)
- Scrap is reduced due to less paste dry out
- Stable tack over 8+ hours
- Brand: Kester®
- Series: EP256
- Product Type: No-Clean Solder Paste
- Physical Form: Paste
- Chemical Composition: Sn63Pb37
- Odor: Mild
- Applications: Soldering
- Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
- Container Type: Jar
- Capacity: 500g
Technical Information
Brand: Kester
Applications: Soldering
Capacity: 500g
Chemical Composition: Sn63Pb37
Container Type: Jar
Odor: Mild
Physical Form: Paste
Product Type: No-Clean Solder Paste
Series: EP256
Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
Weight: 0
Country Of Origin: US
Our Price: $149.14 Jar-JR
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1