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EP256 Series No-Clean Solder Paste, Type 3, Sn63Pb37, 500 Gram Jar

Hisco #:70-0102-0510-16600

MFG #:EP256

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Made in the USA
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
No Cancel, No Returns. Orders placed for this product are non-refundable and cannot be cancelled.
Our Price: $108.28 Jar-JR
Manufacturer Lead Time When Not In Stock7 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
1108.28
3103.00Save 5%

The Kester EP256 is a Series EP256 no-clean solder paste .

Kester EP256 Features:
  • Stable wetting behavior over a wide range of profiles
  • Capable of 90 minute break times in printing
  • High print speeds to 200+ mm/sec (8+ in/sec)
  • Compatible with enclosed print head systems
  • Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
  • High activity on all substrates, including OSPs
  • Capable of off-pad printing with no solderballs after reflow
  • Stencil life:8+ hours (process dependent)
  • Scrap is reduced due to less paste dry out
  • Stable tack over 8+ hours
Kester EP256 Specifications:
  • Brand: Kester®
  • Series: EP256
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Product Description

The Kester EP256 is a Series EP256 no-clean solder paste .

Kester EP256 Features:
  • Stable wetting behavior over a wide range of profiles
  • Capable of 90 minute break times in printing
  • High print speeds to 200+ mm/sec (8+ in/sec)
  • Compatible with enclosed print head systems
  • Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
  • High activity on all substrates, including OSPs
  • Capable of off-pad printing with no solderballs after reflow
  • Stencil life:8+ hours (process dependent)
  • Scrap is reduced due to less paste dry out
  • Stable tack over 8+ hours
Kester EP256 Specifications:
  • Brand: Kester®
  • Series: EP256
  • Product Type: No-Clean Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ROL0 per J-STD-004, Compliant to Bellcore GR-78, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Technical Information

BrandKester
Country Of Origin: US
Our Price: $108.28 Jar-JR
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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