US_HISCO_SPIRE
Information notification:
Due to ongoing tariff updates, pricing is subject to change and may not reflect the latest surcharges. Learn more.
Kester logo

HM531 Series Halide-Free Solder Paste, Type 3, Sn63Pb37, 500g Jar

Hisco #:70-1002-0510-16600

MFG #:70-1002-0510

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
Made in the USA
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
No Cancel, No Returns. Orders placed for this product are non-refundable and cannot be cancelled.
$
Manufacturer Lead Time When Not In Stock:Ā 14Ā days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

The Kester 70-1002-0510 is a Series HM531 water-soluble solder paste .

The Kester 70-1002-0510 Features:
  • Outstanding batch-to-batch consistency
  • Excellent anti-slump characteristics minimizing bridging defects
  • Capable of 60+ minute idle times in printing
  • Capable of print speeds up to 150mm/sec (6in/sec)
  • Excellent solderability to difficult lead-free metalizations with a leaded paste
  • Residues easily removed with hot DI water, even up to 48 hours after soldering
  • Minimal foam in wash systems
  • 8+ hour stencil life
  • Classified as ORM0 per J-STD-004
  • Produces minimal voiding
  • underneath BGA components
  • Compatible with enclosed print head systems
The Kester 70-1002-0510 Specifications:
  • Brand: KesterĀ®
  • Series: HM531
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ORM0 per J-STD-004, J-STD-005, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Product Description

The Kester 70-1002-0510 is a Series HM531 water-soluble solder paste .

The Kester 70-1002-0510 Features:
  • Outstanding batch-to-batch consistency
  • Excellent anti-slump characteristics minimizing bridging defects
  • Capable of 60+ minute idle times in printing
  • Capable of print speeds up to 150mm/sec (6in/sec)
  • Excellent solderability to difficult lead-free metalizations with a leaded paste
  • Residues easily removed with hot DI water, even up to 48 hours after soldering
  • Minimal foam in wash systems
  • 8+ hour stencil life
  • Classified as ORM0 per J-STD-004
  • Produces minimal voiding
  • underneath BGA components
  • Compatible with enclosed print head systems
The Kester 70-1002-0510 Specifications:
  • Brand: KesterĀ®
  • Series: HM531
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn63Pb37
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ORM0 per J-STD-004, J-STD-005, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Technical Information

Brand:Ā Kester
Availability:Ā In Stock
Weight:Ā 1500
Country Of Origin:Ā US
$
Ā 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
North America's Premier Distributor of Mission Critical Materials © 2008-  Copyright Hisco – TestEquity LLC.  All rights reserved.