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Adhesive, Thermally Conductive Epoxy, Medium Cure, 50ml

Hisco #:8329TCM-50ML-33018

MFG #:8329TCM-50ML

No Cancel, No Returns. Orders placed for this product are non-refundable and cannot be cancelled.
Our Price: $55.38 EA
Manufacturer Lead Time When Not In Stock14 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
QuantityPriceSave
155.38
653.39Save 4%
1851.54Save 7%

The MG Chemicals 8329TCM-50ML is a heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.This thermal adhesive paste is most often used to attach heatsinks to CPUs, LEDs, or other heat generating electronic components. It is also suitable in many other applications that require a thermally conductive electrically insulating bond.This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8349TFM) that is suitable for use with mixing tips.This adhesive paste has a 45-minute working time. We also offer a faster setting alternative with a working time of only 5 minutes (8329TFM) and 20 minutes (8349TFM), a heat cure 2-part system with a 4-hour working time (8329TCS), and a heat-cure 1-part alternative with an unlimited working time (9460TC). Electrically conductive alternatives and thermal pastes are also available

MG Chemicals 8329TCM-50ML Features:
  • Thermal conductivity of 1.4 W/(m·K)
  • 1:1 mix ratio
  • Working time: 45 minutes
  • Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F)
  • Provides strong electrical insulation
  • High mechanical strength
  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
MG Chemicals 8329TCM-50ML Specifications:
  • Brand: MG Chemicals
  • Container Volume: 50 mL

Product Description

The MG Chemicals 8329TCM-50ML is a heatsink adhesive paste is a 2-part, 1-1 epoxy system. It is a smooth, dark grey paste that cures to form a hard, durable, thermally conductive polymer. It provides strong electrical insulation and excellent protection from humidity, salt water, mild bases, and aliphatic hydrocarbons. It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies.This thermal adhesive paste is most often used to attach heatsinks to CPUs, LEDs, or other heat generating electronic components. It is also suitable in many other applications that require a thermally conductive electrically insulating bond.This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. We also offer a lower viscosity alternative (8349TFM) that is suitable for use with mixing tips.This adhesive paste has a 45-minute working time. We also offer a faster setting alternative with a working time of only 5 minutes (8329TFM) and 20 minutes (8349TFM), a heat cure 2-part system with a 4-hour working time (8329TCS), and a heat-cure 1-part alternative with an unlimited working time (9460TC). Electrically conductive alternatives and thermal pastes are also available

MG Chemicals 8329TCM-50ML Features:
  • Thermal conductivity of 1.4 W/(m·K)
  • 1:1 mix ratio
  • Working time: 45 minutes
  • Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F)
  • Provides strong electrical insulation
  • High mechanical strength
  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
MG Chemicals 8329TCM-50ML Specifications:
  • Brand: MG Chemicals
  • Container Volume: 50 mL

Technical Information

BrandMG Chemicals
AvailabilityIn Stock
Weight: 0.25
Country Of Origin: CA
Our Price: $55.38 EA
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1
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