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5 Minute® Epoxy Gel Opaque (1-1), 400mL Cartridge

Hisco #:DA052-38794

MFG #:DA052

This item cannot be exported outside of the United States.
Made in the USA
Our Price: $100.28 EA
List Price: 114.69 EA
Manufacturer Lead Time When Not In Stock28 days
Minimum Order QTY: 12
Item must be ordered in multiples of 12
QuantityPriceSave
3698.55Save 2%

The Devcon DA052 fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.

Features:

  • High tensile strength (2,500 psi)
  • Good solvent resistance to gas, oil and other solvents
  • Non sag which makes it ideal for use on vertical surfaces
  • Excellent gap filling qualities without tremendous shrinkage
  • Fast curing for bond tags on machinery and equipment
  • Hardness: 80Shore D
  • Material Compatibility: Metal, Ceramic, Wood
  • Chemical Composition: Phenol,Polymer With Formaldehyde,Glycidyl Ether, Inert Material, Phenol,Polymer With Formaldehyde,Glycidyl Ether
  • Peel Strength: 2 to 3pli
  • Cure Type: Room 75°F
  • Elongation at Break: 5%
  • Applications: Bonding, Potting, Encapsulating

Product Description

The Devcon DA052 fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.

Features:

  • High tensile strength (2,500 psi)
  • Good solvent resistance to gas, oil and other solvents
  • Non sag which makes it ideal for use on vertical surfaces
  • Excellent gap filling qualities without tremendous shrinkage
  • Fast curing for bond tags on machinery and equipment
  • Hardness: 80Shore D
  • Material Compatibility: Metal, Ceramic, Wood
  • Chemical Composition: Phenol,Polymer With Formaldehyde,Glycidyl Ether, Inert Material, Phenol,Polymer With Formaldehyde,Glycidyl Ether
  • Peel Strength: 2 to 3pli
  • Cure Type: Room 75°F
  • Elongation at Break: 5%
  • Applications: Bonding, Potting, Encapsulating

Technical Information

BrandDevcon
Weight: 1.327
Country Of Origin: US
Our Price: $100.28 EA
List Price: 114.69 EA
 
Minimum Order QTY: 12
Item must be ordered in multiples of 12
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