5 Minute® Epoxy Gel Opaque (1-1), 400mL Cartridge
Hisco #:DA052-38794
MFG #:DA052
Our Price: $117.26 Each
List Price: Available to Order - 0 on Hand
Manufacturer Estimated Lead Time When Not In Stock: 28 days
Minimum Order QTY: 12 Eaches
Item must be ordered in multiples of 12
Item must be ordered in multiples of 12
| Quantity | Price | Save |
|---|---|---|
| 36 | 115.24 | Save |
The Devcon DA052 fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.
Features:
- High tensile strength (2,500 psi)
- Good solvent resistance to gas, oil and other solvents
- Non sag which makes it ideal for use on vertical surfaces
- Excellent gap filling qualities without tremendous shrinkage
- Fast curing for bond tags on machinery and equipment
- Hardness: 80Shore D
- Material Compatibility: Metal, Ceramic, Wood
- Chemical Composition: Phenol,Polymer With Formaldehyde,Glycidyl Ether, Inert Material, Phenol,Polymer With Formaldehyde,Glycidyl Ether
- Peel Strength: 2 to 3pli
- Cure Type: Room 75°F
- Elongation at Break: 5%
- Applications: Bonding, Potting, Encapsulating
Product Description
Technical Information
SDS/TDS
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Product Description
The Devcon DA052 fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.
Features:
- High tensile strength (2,500 psi)
- Good solvent resistance to gas, oil and other solvents
- Non sag which makes it ideal for use on vertical surfaces
- Excellent gap filling qualities without tremendous shrinkage
- Fast curing for bond tags on machinery and equipment
- Hardness: 80Shore D
- Material Compatibility: Metal, Ceramic, Wood
- Chemical Composition: Phenol,Polymer With Formaldehyde,Glycidyl Ether, Inert Material, Phenol,Polymer With Formaldehyde,Glycidyl Ether
- Peel Strength: 2 to 3pli
- Cure Type: Room 75°F
- Elongation at Break: 5%
- Applications: Bonding, Potting, Encapsulating
Technical Information
Brand: Devcon
Weight: 1.327
Country Of Origin: US
Harmonized Code: 3506.10.5000
UPC Code: 078143140525
Our Price: $117.26 Each
List Price: Available to Order - 0 on Hand
Minimum Order QTY: 12 Eaches
Item must be ordered in multiples of 12
Item must be ordered in multiples of 12