HSC67 Silicone Heat Sink Compound, 6g Squeeze Tube
Hisco #:HSC67-6G-8211
MFG #:HSC67-6G
Item must be ordered in multiples of 1
| Quantity | Price | Save |
|---|---|---|
| 1 | 6.94 | |
| 3 | 6.26 | Save |
This item is hazardous and may be subject to an additional handling fee.
The CAIG HSC67-6G combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media.
Product Description
This item is hazardous and may be subject to an additional handling fee.
The CAIG HSC67-6G combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal “bridge” to remove heat from a heat source (device) to the ambient via a heat transfer media.
Technical Information
Additional Resources
Item must be ordered in multiples of 1