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HM531 Series Halide-Free Solder Paste, Type 3, Sn62Pb36Ag2.0, 500 Gram Jar

Hisco #:KES7010020310-34339

MFG #:70-1002-0310

This item MUST be shipped via an AIR shipping method.
This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
WARNING: This product can expose you to chemicals or other substances which are known to the State of California to cause cancer or reproductive toxicity. For more information, go to www.P65Warnings.ca.gov.
$
Manufacturer Lead Time When Not In Stock:Ā 25Ā days
Minimum Order QTY: 10
Item must be ordered in multiples of 10

The Kester 70-1002-0310 is a Series HM531 water-soluble solder paste .

The Kester 70-1002-0310 Features:
  • Outstanding batch-to-batch consistency
  • Excellent anti-slump characteristics minimizing bridging defects
  • Capable of 60+ minute idle times in printing
  • Capable of print speeds up to 150mm/sec (6in/sec)
  • Excellent solderability to difficult lead-free metalizations with a leaded paste
  • Residues easily removed with hot DI water, even up to 48 hours after soldering
  • Minimal foam in wash systems
  • 8+ hour stencil life
  • Classified as ORM0 per J-STD-004
  • Produces minimal voiding
  • underneath BGA components
  • Compatible with enclosed print head systems
The Kester 70-1002-0310 Specifications:
  • Brand: KesterĀ®
  • Series: HM531
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn62Pb36Ag2
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ORM0 per J-STD-004, J-STD-005, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Product Description

The Kester 70-1002-0310 is a Series HM531 water-soluble solder paste .

The Kester 70-1002-0310 Features:
  • Outstanding batch-to-batch consistency
  • Excellent anti-slump characteristics minimizing bridging defects
  • Capable of 60+ minute idle times in printing
  • Capable of print speeds up to 150mm/sec (6in/sec)
  • Excellent solderability to difficult lead-free metalizations with a leaded paste
  • Residues easily removed with hot DI water, even up to 48 hours after soldering
  • Minimal foam in wash systems
  • 8+ hour stencil life
  • Classified as ORM0 per J-STD-004
  • Produces minimal voiding
  • underneath BGA components
  • Compatible with enclosed print head systems
The Kester 70-1002-0310 Specifications:
  • Brand: KesterĀ®
  • Series: HM531
  • Product Type: Water-Soluble Solder Paste
  • Physical Form: Paste
  • Chemical Composition: Sn62Pb36Ag2
  • Odor: Mild
  • Applications: Soldering
  • Standards Met: Classified as ORM0 per J-STD-004, J-STD-005, IPC-TM-650
  • Container Type: Jar
  • Capacity: 500g

Technical Information

Brand:Ā Kester
Country Of Origin:Ā DE
$
Ā 
Minimum Order QTY: 10
Item must be ordered in multiples of 10
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