Alpha OM-353 solder paste has the performance you need for ultra-fine feature applications
With ultra-fine feature printing and air reflow capabilities, Alpha's OM-353 solder paste provides unmatched throughput and yield. It delivers excellent coalescence for 160µm circle deposits and head in pillow (HIP) resistance with the least amount of visible residue when compared to other pastes. Residue of Alpha OM-353 remains on the solder joint to improve electrochemical reliability and prevent solder wicking on component leads.