Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications
Summary based on an original article by Amit Patel, Matthew Siebenhuhner, Gyan Dutt, Ranjit Pandher, Mitch Holtzer, and T.W. Mok, Alpha Assembly Solutions
Voiding control is one of the main challenges of electronic component assembly in thermally demanding environments. Whether your market is telecommunications, automotive or ultra-bright LEDs, these applications require low-voiding materials and sometimes, a special vacuum process during soldering to control or reduce voiding. Heat dissipation, thermal shock resistance, vibration and other harsh conditions are some of the factors that affect void frequency and size.
This white paper by Alpha Assembly Solutions on solder voiding control provides an ideal guide for power electronics manufacturers looking to achieve excellent assembly and interconnect reliability.
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