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This article is based on an original publication by Gyan Dutt, Ravi Bhatkal and Alpha, an Alent plc company.
Several considerations should be given to the selection of die attach material in LED applications. These include packaging process, performance, reliability and cost. While eutectic gold-tin, silver-filled epoxies, solder, silicones and sintered materials are all used for LED die attach, they result in varying trade-offs.
This white paper discusses those trade-offs as well as the fit between the die attach materials, different chip structures and their operating power levels. It demonstrates all material platforms have a place in LED die attach, and a diverse portfolio of materials provides options for LED device manufacturers.