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Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
This article is based on an original publication by Henkel Corporation.
Extreme miniaturization in a high-volume, high-reliability production environment is one of the electronics assembly industry's most significant challenges to date. While many process variables can be impacted, possibly none is affected as much as the solder process. With new tighter pitches and smaller geometries, soldering materials must also maintain lead-free properties as well as high temperature compatibility, humidity resistance, and more.
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Traditional Type 3 solder pastes are increasingly less capable of addressing small deposit volume requirements. However, moving to Type 4 paste will not necessarily solve the problem, and it is thus critical that today's Type 4 materials are optimized for extreme miniaturization.