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Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
This article is based on an original publication by Henkel Corporation.
Extreme miniaturization in a high-volume, high-reliability production environment is one of the electronics assembly industry's most significant challenges to date. While many process variables can be impacted, possibly none is affected as much as the solder process. With new tighter pitches and smaller geometries, soldering materials must also maintain lead-free properties as well as high temperature compatibility, humidity resistance, and more.
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