Offer valid only in the continental U.S. on orders totaling $199 or more, excluding all taxes and fees. Orders must ship FedEx Ground Parcel Prepaid. Shipping charges will apply for the following types of products: products that are overweight/oversized, products with HAZMAT restrictions, products that must ship expedited and/or products that must ship expedited due to temperature requirements.
Click to close out this message
Sign in to see your pricing and specialty products.
Void Reduction Strategy for Bottom Termination Components (BTC) Using Flux-Coated Preforms
Summary based on an original article by Anna Lifton, Jerry Sidone, Paul Salerno, Oscar Khaselev and Mike Marczi, Alpha Assembly Solutions.
Klaus Weigl, Gerhard Martl, Rohde-und-Schwarz.
As power density increases and component packages become smaller, the inability of traditional soldering techniques to keep up with today's BTC thermal management requirements has driven manufacturers to look for ways to reduce voids in solder joints more effectively and consistently.
Since there's no one-size-fits-all approach for void reduction under BTCs, this paper will describe how Alpha Assembly Solutions has studied the effectiveness of void reduction technology (VRT) and flux-coated preforms to achieve significant reduction in voiding and produce reliable solder joints.