Move the future forward with high-performance 5G assembly solutions from Alpha.
From mobile devices to infrastructure, hardware and beyond, Alpha offers a broad range of 5G assembly solutions and soldering materials designed for exceptional reliability and performance.
Do Alpha 5G assembly solutions match your requirements?
Communication Devices
- High reliability
- Fine-feature capable
- Improved design flexibility
- Low total cost of ownership
Fronthaul
- High performance
- High reliability in harsh conditions
- Fine-feature capable
- High thermal and electrical conductivity
- Low manufacturing costs
Backhaul
- Improved design flexibility
- High electrochemical reliability
- High thermal and electrical conductivity
- High throughput, low defects
| Product |
Product / Product Attributes |
|---|
| Adhesives |
ALPHA HiTech SM42-1311
- Non-sagging
- Excellent adhesion on FR4
- Resists change due to high heat post application processing (ie. wave soldering)
|
|---|
| Bar Solder |
ALPHA SAC305
- Excellent soldering performance
- High thermal fatigue resistance
- Widely used
|
|---|
ALPHA SACX Plus 0807
- Low silver (0.8%) for improved value vs. SAC305
- AC305-like soldering and reliability performance on complex assemblies
- Low copper dissolution and low drossing
|
| Cored Wire |
ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 & 0807
- Wire diameters down to 0.1mm
- Available in many alloys including Innolot
- Ideal for robotic and manual soldering
|
|---|
| Encapsulant |
ALPHA HiTech EN31-4007B
- Excellent impact bend resistance
- 20-day pot life
- Reworkable
|
|---|
| Liquid Soldering Flux |
ALPHA EF-6808HF
- ROL0, passes IPC J-STD-004B
- Excellent for most standard complexity assemblies
|
|---|
ALPHA EF-8800HF
- ORL0, passes IPC J-STD-004B
- Designed for thick, complex boards
|
| Preforms |
ALPHA Tape and Reel Preforms SAC305 / SACX Plus / Low-temp
- High solder volume precision and production yields using pick and place
- Available in many alloys, sizes and shapes
- Flux-coated versions available
|
|---|
ALPHA BTC-578 Accuflux Preforms SAC305 / SACX Plus / Low-temp
- Increasing thermal conductivity through void reduction
- Low flux residue improves electrochemical reliability
- Prevents mechanical stackup issues through increased solder volume
|
| Solder Paste(s) |
ALPHA OM-353 SAC305 / SACX Plus 0307 & 0807
- Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
- Lowest post reflow residues of Alpha’s chemistries
- Low HIP and NWO defects
|
|---|
ALPHA OM-550 HRL1
- Best mechanical performance in low temp category
- Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
- Significant reduction in warpage-induced defects (ie.HIP and NWO)
|
ALPHA JP-510 SAC305
- Jettable to 0.5mm/.020” pitch
- High mechanical and electrochemical reliability
|
ALPHA JP-501 SnBiAg
- Low HIP and NWO defects
- Jettable to 0.5mm/.020” pitch
|
| Underfill |
ALPHA HiTech CU31-3085B
|
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