Move the future forward with high-performance 5G assembly solutions from Alpha.

From mobile devices to infrastructure, hardware and beyond, Alpha offers a broad range of 5G assembly solutions and soldering materials designed for exceptional reliability and performance.

Do Alpha 5G assembly solutions match your requirements?

Communication Devices

  • High reliability
  • Fine-feature capable
  • Improved design flexibility
  • Low total cost of ownership

Fronthaul

  • High performance
  • High reliability in harsh conditions
  • Fine-feature capable
  • High thermal and electrical conductivity
  • Low manufacturing costs

Backhaul

  • Improved design flexibility
  • High electrochemical reliability
  • High thermal and electrical conductivity
  • High throughput, low defects
Product Product / Product Attributes
Adhesives ALPHA HiTech SM42-1311
  • Non-sagging
  • Excellent adhesion on FR4
  • Resists change due to high heat post application processing (ie. wave soldering)
Bar Solder ALPHA SAC305
  • Excellent soldering performance
  • High thermal fatigue resistance
  • Widely used
ALPHA SACX Plus 0807
  • Low silver (0.8%) for improved value vs. SAC305
  • AC305-like soldering and reliability performance on complex assemblies
  • Low copper dissolution and low drossing
Cored Wire ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 & 0807
  • Wire diameters down to 0.1mm
  • Available in many alloys including Innolot
  • Ideal for robotic and manual soldering
Encapsulant ALPHA HiTech EN31-4007B
  • Excellent impact bend resistance
  • 20-day pot life
  • Reworkable
Liquid Soldering Flux ALPHA EF-6808HF
  • ROL0, passes IPC J-STD-004B
  • Excellent for most standard complexity assemblies
ALPHA EF-8800HF
  • ORL0, passes IPC J-STD-004B
  • Designed for thick, complex boards
Preforms ALPHA Tape and Reel Preforms SAC305 / SACX Plus / Low-temp
  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux-coated versions available
ALPHA BTC-578 Accuflux Preforms SAC305 / SACX Plus / Low-temp
  • Increasing thermal conductivity through void reduction
  • Low flux residue improves electrochemical reliability
  • Prevents mechanical stackup issues through increased solder volume
Solder Paste(s) ALPHA OM-353 SAC305 / SACX Plus 0307 & 0807
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Lowest post reflow residues of Alpha’s chemistries
  • Low HIP and NWO defects
ALPHA OM-550 HRL1
  • Best mechanical performance in low temp category
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects (ie.HIP and NWO)
ALPHA JP-510 SAC305
  • Jettable to 0.5mm/.020” pitch
  • High mechanical and electrochemical reliability
ALPHA JP-501 SnBiAg
  • Low HIP and NWO defects
  • Jettable to 0.5mm/.020” pitch
Underfill ALPHA HiTech CU31-3085B
  • Fast flow & reworkable

Find out more about Alpha 5G assembly solutions.


MacDermid Alpha
Enabling 5G From Start to Finish Brochure