Move the future forward with high-performance 5G assembly solutions from Alpha.

From mobile devices to infrastructure, hardware and beyond, Alpha offers a broad range of 5G assembly solutions and soldering materials designed for exceptional reliability and performance.

Do Alpha 5G assembly solutions match your requirements?

Communication Devices

High reliability
Fine-feature capable
Improved design flexibility
Low total cost of ownership

Fronthaul

High performance
High reliability in harsh conditions
Fine-feature capable
High thermal and electrical conductivity
Low manufacturing costs

Backhaul

Improved design flexibility
High electrochemical reliability
High thermal and electrical conductivity
High throughput, low defects

Product	Product / Product Attributes
Adhesives	ALPHA HiTech SM42-1311 Non-sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (ie. wave soldering)
Bar Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar Solder	ALPHA SACX Plus 0807 Low silver (0.8%) for improved value vs. SAC305 AC305-like soldering and reliability performance on complex assemblies Low copper dissolution and low drossing
Cored Wire	ALPHA Telecore HF-850 SAC305 / SACX Plus 0307 & 0807 Wire diameters down to 0.1mm Available in many alloys including Innolot Ideal for robotic and manual soldering
Encapsulant	ALPHA HiTech EN31-4007B Excellent impact bend resistance 20-day pot life Reworkable
Liquid Soldering Flux	ALPHA EF-6808HF ROL0, passes IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Soldering Flux	ALPHA EF-8800HF ORL0, passes IPC J-STD-004B Designed for thick, complex boards
Preforms	ALPHA Tape and Reel Preforms SAC305 / SACX Plus / Low-temp High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes Flux-coated versions available
Preforms	ALPHA BTC-578 Accuflux Preforms SAC305 / SACX Plus / Low-temp Increasing thermal conductivity through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Paste(s)	ALPHA OM-353 SAC305 / SACX Plus 0307 & 0807 Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Lowest post reflow residues of Alpha’s chemistries Low HIP and NWO defects
	ALPHA OM-550 HRL1 Best mechanical performance in low temp category Repeatable printing down to 0.3mm/.012” pitch and 01005 passives Significant reduction in warpage-induced defects (ie.HIP and NWO)
	ALPHA JP-510 SAC305 Jettable to 0.5mm/.020” pitch High mechanical and electrochemical reliability
	ALPHA JP-501 SnBiAg Low HIP and NWO defects Jettable to 0.5mm/.020” pitch
Underfill	ALPHA HiTech CU31-3085B Fast flow & reworkable

Find out more about Alpha 5G assembly solutions.

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MacDermid Alpha
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